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View All Spec Tables
IDR - Rp
Hasil Pencarian Untuk "50 micro"
Specification Tables
2 Hasil
Turning Inserts
3279 Items
Thickness
0.188", 0.0938", 1.5, 0.1883", 3, 4, 0.2508", 1/16", 1
Primary Material Application
Titanium, Steel, Nickel, Aluminum, Non-Ferrous, High-Temperature Alloys, Titanium, Stainless Steel, Nickel, Magnesium, Cast Iron, Aluminum, Bronze, Brass, Copper
Insert Style
CCGX, CCMT, VNGA, VCMA, CNGA
Corner Radius
0.0070", .5, 0.05 mm, 0.0240", .5, 0.0070", 0.0078", .5
Finish - Machining
TiAlN+AlCrN, TiAlN+WC/C, TiN+Al2O3+TiCN, TiBN, TiN+TiAlN+TiN
D Sub Connectors
351 Items
Length
53.04 mm, 39.2 mm, 30.0 mm, 39.4 mm, 30.8 mm
Pitch
2.76 mm, 2.54 mm, 2.74 mm, 2.77 mm, 1.27 mm
Current Rating
1 A, 3 A, 1.5 A, 2 A, 5 A
Mounting Type
Cable Mount, Panel Mount, Panel Mount, Through Hole Mount Right Angle, Surface Mount Right Angle, Through Hole Mount Right Angle, Through Hole Mount
Depth
10.31 mm, 15.4 mm, 16.4 mm, 67.5 mm, 5.9 mm
Brands
3 Hasil
MICRO100
3 Produk
Micro 100
3 Produk
TE Connectivity
3 Produk
Produk
6 Hasil
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Relevansi
Harga: Tetinggi Ke Terendah
Harga: Terendah Ke Tertinggi
MOQ: 2
Rp
1.154.796
Insert Bubut Berlian
Micro
100
50
-1105
Rp
11.925.793
Te Connectivity MBMMD-EFSMS0-08-
50
-1-C-H
Micro
Mini Split Backshell, 90DEG, Df
Rp
13.698.162
Te Connectivity MBMMD-EGSMS0-08-
50
-1-C-H
Micro
Mini Split Backshell, 90DEG, Dg
MOQ: 2
Rp
1.132.630
Micro
100
50
-1200 Mata Bubut Berlian
MOQ: 2
Rp
1.085.528
Micro
100
50
-1100 Sisipan Bubut Berlian
MOQ: 50
Rp
29.774.308
Te Connectivity MBMMD-EFTMS0-08-
50
-1-C-H
Micro
Mini Split Backshell, 90DEG, Df
1
Atas
